Canlyniadau Chwilio - "Chemistry"

1

Desarrollo de un proceso libre de cianuros para la electrodeposicin̤ de pelc̕ulas de cobre-zinc con aplicaciones en la produccin̤ de hidrg̤eno y latn̤ comercial

Pynciau: “...Chemistry...”
Desarrollo de un proceso libre de cianuros para la electrodeposicin̤ de pelc̕ulas de cobre-zinc con aplicaciones en la produccin̤ de hidrg̤eno y latn̤ comercial

Llyfr

2

Preparation and characterization of copper powders with Sn coating by the electroless plating

Pynciau: “...Chemistry...”
Preparation and characterization of copper powders with Sn coating by the electroless plating

Llyfr

3

Comparative study of electroless copper film on different self-assembled monolayers modified ABS substrate

Pynciau: “...Chemistry...”
Comparative study of electroless copper film on different self-assembled monolayers modified ABS substrate

Llyfr

4

Formulation of novel electroless plating process for Cu and Cu-P alloys

Pynciau: “...Chemistry...”
Formulation of novel electroless plating process for Cu and Cu-P alloys

Llyfr

5

Properties of immersion tin coatings deposition from methanesulphonic acid solutions

Pynciau: “...Chemistry...”
Properties of immersion tin coatings deposition from methanesulphonic acid solutions

Llyfr

6

Electroless tin deposition on copper from thiourea type baths

Pynciau: “...Chemistry...”
Electroless tin deposition on copper from thiourea type baths

Llyfr

7

Whisker formation on galvanic tin surface layer

Pynciau: “...Chemistry...”
Whisker formation on galvanic tin surface layer

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8

Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer

Pynciau: “...Chemistry...”
Electroless copper deposition using saccharose containing copper methane sulphonate bath with thiourea as stabilizer

Llyfr

9

Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent

Pynciau: “...Chemistry...”
Influence of pH solution on electroless copper plating using sodium hypophosphite as reducing agent

Llyfr

10

Application of environment-friendly ligands for alkaline electroless copper plating systems , a comparative study of electroless copper deposition using D-, L- and DL-tartrate as C...

Pynciau: “...Chemistry...”
Application of environment-friendly ligands for alkaline electroless copper plating systems , a comparative study of electroless copper deposition using D-, L- and DL-tartrate as Cu(II) ligands

Llyfr

11

Estudio de la resistencia a la corrosin̤ electroqum̕ica de electro-recubrimientos nq̕uel/cobre obtenidos por corriente pulsante

Pynciau: “...Chemistry...”
Estudio de la resistencia a la corrosin̤ electroqum̕ica de electro-recubrimientos nq̕uel/cobre obtenidos por corriente pulsante

Llyfr

12

Recovery of cobalt and copper from textile, electroplating and tannery effluents using electrocoagulation method

Pynciau: “...Chemistry...”
Recovery of cobalt and copper from textile, electroplating and tannery effluents using electrocoagulation method

Llyfr

13

Effect of electroless copper coating on the corrosion behavior of aluminium based metal matrix composites reinforced with silicon carbide particles

Pynciau: “...Chemistry...”
Effect of electroless copper coating on the corrosion behavior of aluminium based metal matrix composites reinforced with silicon carbide particles

Llyfr

14

Comparative study on the effects of surfactants on the electroless copper coated solar cell and optimizing its process parameters

Pynciau: “...Chemistry...”
Comparative study on the effects of surfactants on the electroless copper coated solar cell and optimizing its process parameters

Llyfr

15

Effects of Cu feedstock on intermetallic compound formation in cold sprayed Cu-Sn coatings

Pynciau: “...Chemistry...”
Effects of Cu feedstock on intermetallic compound formation in cold sprayed Cu-Sn coatings

Llyfr

16

Copper removal from electroplating wastewater by coprecipitation of copper-based supramolecular materials , preparation and application study

Pynciau: “...Chemistry...”
Copper removal from electroplating wastewater by coprecipitation of copper-based supramolecular materials , preparation and application study

Llyfr

17

Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating

Pynciau: “...Chemistry...”
Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating

Llyfr

18

Adsorption of Pb, Fe, Cu, and Zn from industrial electroplating wastewater by orange peel activated carbon

Pynciau: “...Chemistry...”
Adsorption of Pb, Fe, Cu, and Zn from industrial electroplating wastewater by orange peel activated carbon

Llyfr

19

Review of the potential of the Ni/Cu plating technique for crystalline silicon solar cells

Pynciau: “...Chemistry...”
Review of the potential of the Ni/Cu plating technique for crystalline silicon solar cells

Llyfr

Manylu'r Chwiliad