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Author:
Lau, John H.,
Library:
Acces Engineering
Call Number:
T - Technology
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eBook
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Flip chip technology
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Reliability
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Author:
Lau, John H.,
Library:
Acces Engineering
Call Number:
T - Technology
Format:
eBook
Suggested Topics:
Flip chip technology
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Reliability
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Microvias : for low-cost, high-density interconnects /
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Lau, John H.,
Published 2001
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Institution
Acces Engineering
1
Library
Acces Engineering
Format
eBook
Call Number
T - Technology
Author
Lau, John H.,
Lee, S. W. Ricky
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Language
English
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Electronic books
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