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Author:
Lau, John H.
Library:
Acces Engineering
Call Number:
T - Technology
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Electronic
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Internet resources
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Author:
Lau, John H.
Library:
Acces Engineering
Call Number:
T - Technology
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Internet resources
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Reliability of RoHS-Compliant 2D and 3D IC interconnects
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Lau, John H.
Published 2011
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Advanced MEMS packaging
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Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials
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Institution
Acces Engineering
3
Library
Acces Engineering
Format
Electronic
eBook
3
Call Number
T - Technology
Author
Lau, John H.
Aibin, Yu
1
Lee, Chengkuo
1
Premachandran, C. S.
1
Language
English
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Electronic books
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